MediaTek and TSMC have announced their successful collaboration in developing MediaTek's first-ever 3-nanometer (nm) chip using TSMC’s cutting-edge technology, with volume production expected next year.
This collaboration marks a significant milestone in the longstanding strategic relationship between MediaTek and TSMC, with both companies taking full advantage of their capabilities in chip design and manufacturing to jointly establish flagship systems-on-chip (SoC) with high-performance and low-power features, empowering global semiconductor manufacturing.
“We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways,” said Joe Chen, president of MediaTek. “TSMC's consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of [the] industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, senior vice president of Europe and Asia sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“
Compared to TSMC’s N5 process, TSMC’s 3nm process technology provides more significant improvements in performance, power and yield, in addition to complete platform support for both extremely efficient computing and mobile applications. TSMC’s 3nm technology currently offers up to 18% speed improvement at the same power consumption or 32% power reduction at the same speed. Additionally, this technology enables a 60% increase in logic density, paving the way for more powerful and competent devices.
MediaTek's Dimensity SoCs are designed to meet the growing user experience requirements for mobile computing, high-speed connectivity, artificial intelligence and multimedia. MediaTek’s first flagship chipset using TSMC’s 3nm process is expected to strengthen smartphones, tablets, intelligent cars and various other devices starting in the second half of 2024.
